Global Foundries talks about TSVs on 20nm
Wafers fully baked and work just fine
Global Foundries has taken a huge step toward mass-market TSVs with their first 20nm wafer with that technology.
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Global Foundries has taken a huge step toward mass-market TSVs with their first 20nm wafer with that technology.
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It looks like TSMC and ARM are getting serious about 64-bit CPUs, they just taped out a Coretex-A57 CPU on 20nm.
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There has been a lot of speculation about Apple and fabs lately, so let’s go over what SemiAccurate is hearing.
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One of the burning questions in the foundry world of late is what node will EUV be introduced on.
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SemiAccurate talked about the process side of Global Foundries a few days ago, but being a foundry is much more than printing designs.
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Global Foundries laid out their roadmap for the next few years at Common Platform, and this time it went to the 10nm node.
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Samsung was showing off their 20nm/14nm hybrid process wafers at Common Platform, the first one SemiAccurate has seen in the flesh.
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At the Common Platform conference today, IBM showed off a bunch of goodies including two new types of wafers.
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Two pictures of wafers to kick off the day, a Global Foundries 20nm wafer, and a 14nm wafer.
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A few details about Intel’s Broadwell chip are now leaking, and the biggest bang is surrounding the GPU.
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During their Q1 conference call, Intel stated that Atom was going to move faster than Moore’s law.
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Samsung wasn’t going to be shown up by IBM at the wafer bragging sweepstakes, so they showed of a 14nm wafer and a 20nm wafer.
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IBM was the first to show off 14nm wafers at Common Platform last week, and they are pretty.
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