Tag Archives: chip stacking

Charlie Demerjian
Feb 7, 2013

IBM adds .5 dimensions to chip stacks in one year

Common Platform 2013: 2.5D at the 2012 show, 3D in 2013, next year…

IBM had two packaging goodies on display at Common Platform including one that SemiAccurate has shown you before.
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Charlie Demerjian
Nov 8, 2012

A look at how Xilinx uses stacking on the Virtex-7 HT

Hot Chips 24: Interposers lead to heterogenous lifestyles

There is a lot of talk about the benefits of chip stacking, but only one company is doing it in volume, Xilinx.
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Mads Ølholm
Sep 7, 2011

3M and IBM get into the skyscraper business

Invents heat conducting glue that will allow stacking of up to 100 layers.

Tech Giants 3M (NYSE:MMM) and IBM (NYSE:IBM) have combined their research talent and come up with a new glue that will allow them to stack chips with up to 100 semiconductor layers, the companies write in a press release.
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SemiAccurate

On Target Technology News

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