TSMC has just released their Q210 financial statements and the picture is pretty bright. They managed to grow in sales, their margins increased and the ramp up of their 40nm process seems on track, their inventory days were almost the same and their debt is hedge only.
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ALTHOUGH AMD IS expected to unveil its Ontario platform this side of Christmas, it looks like we’ll have to wait until Q1 next year to see any retail products in the market. That’s a long wait for those that are hoping to get their hands on the first Fusion hardware from AMD, but hopefully it won’t be a wait in vain.
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HARD DRIVE DATA density has taken another leap forward, although this time it’s thanks to Samsung, of all companies, as it latest EcoGreen F4 2TB hard drive features no less than 667GB of storage space per platter. That means that you only need three platters to create a 2TB drive, something Samsung’s competitors have yet to accomplish.
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After over 3 years of running around the legal jungle gym, the United Stated Department of Justice has finally caught up with Hewlett-Packard, the world’s current leading provider of technological stuff, and reached a settlement after rubbing HP’s face in the sand a couple of times [ DOJ -1 | HP -0 ]. The settlement lays to rest 2007 allegations of kickbacks and fraud related to government contracts negotiated by technology contractor Accenture over the past decade.
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THE CRACKS ARE starting to show at Nvidia’s Tegra unit, with some more huge contracts hanging on by a thread, and key people being shown the door. Couple that with a roadmap shakeup, and you have the right formula for a mess.
UPDATED: 3:55pm August 2, 2010
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ONE OF THE steps that any manufacturer of USB compliant devices has to pass is getting certified by the USB-IF so that the USB device is proven to be compatible with the USB standard. This has been one of the big hindrances for USB 3.0 solutions and it seems to be holding back Taiwanese manufacturers of USB 3.0 ICs to the degree that we won’t see any significant shipments of USB 3.0 compliant chips from Taiwan this year.
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AS MUCH AS Intel wants to get into tablets and smartphones it seem to be an uphill struggle for the company. The problem is that Intel is anything but the only manufacturer of chips that go into these types of devices. ARM and its partners have something of a lead here. As such it looks like Intel is going to have to come up with something extraordinary to convince partners to move away from ARM and onto its x86 platform for these types of devices.
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WATERCOOLING, THE CHOICE of, well at least some overclockers, but it seems to be mostly used as a marketing tool these days without any real market penetration. Kingston has just announced three sets of HyperX H2O memory modules (which we spied back at CES), all of which feature support for water cooling. We just can’t quite figure out who is going to buy these new modules.
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INTEL AND GE have are doing something with healthcare today, and there is a webcast going on as this is written. Thoughtfully, Intel and GE have saved us from the excitement of that webcast through advanced technical features.
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