ASUS HAD A ton of goodies at CES, and most didn’t make headlines because the flashier things like GPUs and mobos got all of the love from the press. Some of the devices that fell through the cracks however were …
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AS SOON AS a chipmaker announces a new chip, the OEMs and ODMs come out with new products to support that part. In this case, Tyan has a new board and barebones system for the refreshed Opteron 6100 chips.
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DELL HAS REFRESHED 24 computers in it’s Latitude, Precision, and Optiplex lines, adding Sandy Bridge CPUs, a bunch of new features, a new look, and a lot of subtleties. The only real question remaining is when they will ship, but that isn’t really in Dell’s hands now.
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INTEL’S ROMLEY PLATFORM is set to launch sometime in the second half of this year and it will bring with it a world of confusion in the Xeon market space as Intel will be offering both LGA-1356 and LGA-2011 solutions to its partners. The main difference is that the LGA-1356 platform will support triple channel memory while the LGA-2011 platform will support quad channel memory, but it doesn’t stop there.
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THE FINAL KEYNOTE of the Common Platform conference was given by IBM’s Garry Patton, and he talked collaboration and tech. The list of new things thrown out was pretty dizzying, but what do you expect from someone who is in charge of semiconductor R&D?
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IT’S COME TO our attention that several of the big retail brand DIMM manufacturers are struggling, as memory modules just don’t have enough margins these days. Many are now trying to find ways to branch out and create other product categories, something we saw the start of last year, but it’s not easy to find a market with high margins these days.
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THE COMMON PLATFORM alliance, Global Foundries, IBM and Samsung had a conference Tuesday to announce their renewed alliance and show off their respective wares. Samsung’s NS Woo, President and GM of the LSI Division kicked it off in the first of three keynotes.
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VIA WAS SHOWING off two USB3 goodies at CES, an optical zero client board and a USB3 flash controller. Both look to be really big sellers in their respective fields, but you will probably never know you are using them.
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TOSHIBA HAD SOME innovative flash products on display at CES, from large capacities to small form factors. Visiting them also solved one of the biggest head scratching questions of the show.
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CRUCIAL IS STEPPING out from Micron in the branding world, and is doing so by introducing a new drive. Welcome to the new Crucial M4 SSD, it is not the same as the Micron C400.
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EYE-FI MAY NOT have new cards to show off, but that doesn’t mean they aren’t showing off worthwhile new features. At CES, they added background dumping to the cloud via cell phones, amazingly handy if done right.
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Victorinox had an impressive spread of pocket knives on display, nearly all of them containing one or more flash memory sticks of some sort. The Belle of the Ball however had to be the unreleased “Presentation Master” knife/biometric protected flash drive/Bluetooth Power Point slide advancer/laser pointer/nail file/screw driver/scissors/owner of my heart.
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File this one in the WTF folder. Toshiba managed to pique our interest with an ingenious, yet slightly crazy/useless display gimmick. An SSD board was mounted inside of a fish bowl, mostly submerged in ordinary water (made slightly alcoholic once everyone’s back was turned,) and was booted from on a computer next to the tank. Utterly useless? Yes. Attention getting? Yes. Can you do this at home? Yes (just don’t send us the repair bill.)
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LACIE IS DOING a USB3 flash drive that is really a SATA SSD in a small box. On top of that, they are re-doing their entire line to add USB3 support.
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MOTION HAD THE first production Oak Trail tablet at CES, and it shows a lot of potential. Barring one crippling flaw, it looks head and shoulders above the ARM field.
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