It’s the S|A Weekly Roundup!
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According to several sources in the supply chain that we have spoken with, Intel (NASDAQ:INTC) is working very aggressively with vendors of notebook chassis makers to drive prices down in the hope of being able to have Ultrabooks on the market for less than $1000.
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Remember when we said that Qualcomm decided to bang the branding drum really hard at Computex?
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The problems with Intel’s Sandy Bridge-E have finally started to come in to focus, and they are troubling.
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TSMC is doing some thing that are sure to make AMD and Nvidia grumble, and grumble a lot.
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Tech Giants 3M (NYSE:MMM) and IBM (NYSE:IBM) have combined their research talent and come up with a new glue that will allow them to stack chips with up to 100 semiconductor layers, the companies write in a press release.
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It’s the S|A Weekly Roundup!
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What is going on with AMD’s Bulldozer and why did it only ship last week?
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Global Foundries is having the proverbial ‘issues’ with their high end 32nm-SHP process.
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Intel (NASDAQ:INTC) currently has a project underway in Intel Labs China here in Beijing, where the company is looking into the possibility of replacing Digital Signal Processors in 3G/4G base stations with general purpose hardware.
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Running around AMD HQ yesterday, you get to occasionally see some things you probably shouldn’t be allowed to know about.
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There have been a lot of rumors about why Intel’s Ivy Bridge is slipping, but they are all spin to cover the real issues.
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The Korean smartphones coming from LG and Samsung based on a hypervisor from VMware (NYSE:VMW) are just the beginning of a completely new adventure for VMware.
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VMware (NYSE:VMW) has talked about its mobile hypervisor for Android the past year and now it is ready for prime time, VMware revealed during their VMworld conference here in Las Vegas.
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Global Foundries and Samsung put out a joint release about a new 28nm process, conveniently jointly developed.
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