WE’RE STILL WAITING for the USB 3.0 host controller “war” to start, but after speaking with Renesas at TFE 2010 it looks like the company is already preparing for what will come. We also confirmed that Renesas is indeed working with AMD to help implement USB 3.0 support in its future chipsets.
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AMD SHOWED OFF a Llano board last week in Los Angeles, and again today in Taipei. Take a look at it, and notice two things, how small the heat sink is, and how few components are on the board.
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This week in Taipei AMD showed a short demo of Brazos. We will note that the cameraman needs training and better equipment. However, we do feel the need to bring you this for your viewing pleasure or pain.
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This week in Taipei AMD showed a short demo of Fusion. We will note that the cameraman needs training and better equipment. However, we do feel the need to bring you this for your viewing pleasure or pain.
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AMD SHOWED OFF a Llano wafer at TFE 2010. Yay fusion. Click below for some pictures, more to come later today.
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THE ORIGINAL ANNOUNCEMENT back in June seems to have been generally missed, possibly because most of us aren’t familiar with the Common Platform Alliance, an organization striving for a common, open design ecosystem and fab synchronization, amongst other things. Global Foundries, IBM, and Samsung are the key foundries that make up the Common Platform Alliance and they’re all currently working on a joint 28nm process technology platform which will make life easier for their customers.
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IF YOU LIVE somewhere you can’t get Google TV, yet want an Android device attached to your brand new flat panel TV, then maybe Webia’s Android TV is what you’ve been waiting for. We spotted the Android powered box at the Broadband Taiwan show and it piqued our interest as there aren’t too many devices of its kind that run Android as yet.
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BACK IN SEPTEMBER ARM and Global Foundries announced that they had taped out the industry’s first 28nm ARM Cortex A9 SoC using Gate First High-K Metal Gate technology. Although not much more detail was given at the time, Global Foundries did unveil a little more of what to expect from this partnership at GTC Asia.
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EARLIER TODAY WE attended Global Foundries Technology Conference Asia 2010 (GTC) and judging by the presentations, the company is without a doubt getting ready to give it its best to beat TSMC at its own game. Global Foundries is readying its 28nm production ramp and some early products are already being made, although this is only risk production with actual full on production taking place later next year.
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WE’RE SURE THAT this isn’t coming as a surprise to anyone, but Intel will be offering embedded processors based on its Sandy Bridge core and the first models should appear around the same time as Intel’s mobile and desktop counterparts. However, the company is also readying a set of low power processors based on the mobile Sandy Bridge processors which will be slightly different from their mobile counterparts.
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WITHOUT A DOUBT one of the biggest flaws of the USB standard is the childishly low amounts of power that can be provided and it’s been a major bugbear of the USB protocol. USB 3.0 upped it slightly, but 900mA is hardly what we’d call generous, but it seems like Intel has finally caught on and is considering some serious changes.
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WE FIGURED SOME of you might be interested in knowing what Intel has planned for its next generation of Sandy Bridge Xeon processors when it comes to the model numbers and we’re afraid we have bad news; it’s gotten even more complex. If you read our piece detailing some of Intel’s new Xeon processors based on Sandy Bridge, then you’ll know that Intel has changed its numbering scheme once again and the Xeon’s now start their model name with an E and then it gets trickier from there on in.
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JUDGING BY THE multitude of leaks pertaining Intel’s upcoming Sandy Bridge processors, we know we’re getting closer and closer to the January launch. A few more details about some of the unknown factors about the new CPUs and chipsets have made their way online, alongside detailed specifications of Intel’s LGA-1155 Xeon processors based on the Sandy Bridge core.
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A FEW MONTHS ago, we broke the story about large chunks of EVGA’s mobo team leaving for Sapphire. Just over a month ago, the rest of the team joined their colleagues in less green pastures.
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OPEN SOURCE DEVELOPMENT board for ARM seems to have become a new business opportunity, or something of the sort. The BeagleBoard was the first real hit and now it appears we have a new contender that’s getting ready to unleash an even more powerful development board, namely the PandaBoard.
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