One of the most interesting technologies shown in 2018 was Intel’s Foveros chip stacking.
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It looks like Hynix is the first to show off LPDDR4x modules and 8GB phone memory stacks.
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Last week ARM announced a new process for it’s Artisan POP, UMC’s 28HPC.
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Disco makes devices to process wafers such as saws, grinders, and processing tools but the results are quite exceptional.
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At Techcon ARM announced 11 new POP products to a world that mostly replied, “What is POP?”
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The up front licensing costs are actually the simplest part of the story, from here it gets a little tricky.
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Samsung has two memory advances to talk about one flash and one DDR, one real the other not quite real.
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