At IDF, Rambus was demonstrating the technology of their newest acquisition, Cryptography Research.
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At IDF, Intel was showing off a new research project called Heterogeneous Connection Manager.
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Remember when we said that Qualcomm decided to bang the branding drum really hard at Computex?
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Marvell (NASDAQ:MRVL) has just announced its latest wireless modem the PXA1801 that integrate a host of wireless standards including FDD-LTE, TDD-LTE, HSPA+, TD-SCDMA and EDGE in a single chip.
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Tech Giants 3M (NYSE:MMM) and IBM (NYSE:IBM) have combined their research talent and come up with a new glue that will allow them to stack chips with up to 100 semiconductor layers, the companies write in a press release.
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Global Foundries is having the proverbial ‘issues’ with their high end 32nm-SHP process.
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Running around AMD HQ yesterday, you get to occasionally see some things you probably shouldn’t be allowed to know about.
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The Korean smartphones coming from LG and Samsung based on a hypervisor from VMware (NYSE:VMW) are just the beginning of a completely new adventure for VMware.
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Global Foundries and Samsung put out a joint release about a new 28nm process, conveniently jointly developed.
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It looks like WebOS may not be dead after all, even though HP has canceled the TouchPad, there are signs that Samsung (SEO:0059300) may be interested in buying the operating system behind the TouchPad.
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Acer (TPE:2353) shares stopped trading briefly in Taiwan this morning as they hit what is called “limit low”, indicating that the stock exchange has a severe imbalance between buyers and sellers.
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Yesterday, we showed you the Nvidia 28nm mobile lineup, now it is time for the AMD version as well.
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What does Nvidia have coming up for the post-Christmas GPU line?
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Being in Palo Alto for Hot Chips 23, you run in to a lot of people who know things about big stories like the HP PC fire sale and Palm knifing.
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