Last week at Vision 2022, Intel showed off a bunch of wafers from unreleased processes.
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There has been a lot of talk about Intel outsourcing production lately, but what is really going on?
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When does Intel get their first parts back from TSMC, and what are they?
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The question on everyone’s mind is what moves Intel will be making with TSMC.
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A few months ago SemiAccurate claimed Intel killed their 10nm process, we were wrong.
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ARM showed off a unique M0 cored SoC at Techcon, it was a plastic chip.
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SemiAccurate spotted a Samsung 10nm wafer at Techcon 2015, the only 10nm part publicly displayed.
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Disco makes devices to process wafers such as saws, grinders, and processing tools but the results are quite exceptional.
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End of year lulls allow you to do things you haven’t had time for before like stories about Samsung 14nm FinFET SoCs.
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TSMC was showing off two wafers at Techcon, a production 20nm SoC and a pre-production 16nm without any qualifiers.
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Global Foundries has taken a huge step toward mass-market TSVs with their first 20nm wafer with that technology.
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Samsung was showing off their 20nm/14nm hybrid process wafers at Common Platform, the first one SemiAccurate has seen in the flesh.
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A lot of people have been asking about Rosepoint, the Intel Atom plus digital radio.
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The first thing that caught our eye at Hynix were the SSDs, nothing amazing to look at, but they use a Sandforce controller.
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IBM was the first to show off 14nm wafers at Common Platform last week, and they are pretty.
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