AMD’s 3D V-Cache takes the advanced packaging lead
Computex 2021: This one is real, most others are not
AMD just vaulted back into the advanced packaging lead last night with their 3D V-Cache technology.
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AMD just vaulted back into the advanced packaging lead last night with their 3D V-Cache technology.
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AMD has a bunch of goodies at Computex including CPUs, GPUs, and software.
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Intel just doesn’t know how to stop digging and Computex is a shining example of their corporate dishonesty.
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Today Qualcomm introduces the Snapdragon 7c Gen 2 platform and SemiAccurate doesn’t get it.
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Qualcomm is announcing a bunch of modem oriented goodies at their 5G summit today.
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Today Intel releases their 8-core Tiger Lake-H mobile CPU and it doesn’t change the world.
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OregonLive got a scoop about Intel potentially renaming their 7nm process to 5nm to match the marketing schemes from the foundries.
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Today Intel is launching 3rd Gen Xeon CPUs once again but this time they are based on Ice Lake-SP silicon.
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During Intel’s unleashed event a few weeks ago, CEO Pat Gelsinger talked about building out fab capacity.
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Last August SemiAccurate compared the performance of Intel’s upcoming Ice Lake-SP server to AMD’s Milan with some leaked benchmarks.
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Yesterday a more sedate than usual Pat Gelsinger delivered his vision for the future of Intel.
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Dell is launching 17 new servers today, five with AMD’s Epyc and 12 with Intel’s unnamed upcoming CPU.
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AMD is launching the Pro versions of their Ryzen 5000 Mobile line today.
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Rocket Lake perfectly sums up the rapidly worsening malaise that Intel is mired in, there is no up side.
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Today AMD finally launches Milan, the Epyc 7xx3 line, about six months after it went on sale.
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