Amkor’s FCmBGA packaging
LSI AIS 2012: Wire bond package + Flip Chip die = FCmBGA
Amkor was showing off a package type I hadn’t seen before called FCmBGA at LSI’s AIS.
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Amkor was showing off a package type I hadn’t seen before called FCmBGA at LSI’s AIS.
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Netronome and Argon are putting out a very unique network flow simulator device that should change the market.
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Everspin has introduced a production ST-MRAM memory that combines high speeds, high density, and non-volatile storage.
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LSI has a new name for the HA-DAS shown at IDF, plus a family to go with it.
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Microsoft is in deep trouble, their two main product lines are failing, and the blame game is intensifying.
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The most pertinent question surrounding Intel’s new Xeon Phi is not what it can do, but what it does to the competition.
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To brief journalists on the new Knights Corner/MIC/Xeon Phi cards, Intel brought us to TACC to see a supercomputer based on it.
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Intel talked a bit about the MIC programming model at Hot Chips, but the details show how easy it is.
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Intel is finally taking the wraps off of Knights Corner, the product now known as Xeon Phi.
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Remember that dual Tahiti Firepro SemiAccurate wrote about in August?
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Yesterday, Intel announced the brand new Itanium 9500 series, and no one cared.
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There is a lot of talk about the benefits of chip stacking, but only one company is doing it in volume, Xilinx.
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There has been a lot of talk recently about voting machine problems, especially touch screen voting machines, and it has a very easy technical explanation.
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It looks like the ever slipping AMD Kaveri chip just got another year to ripen on the proverbial vine.
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Updated 11-5-12: What do you get if you replace the Bulldozer cores in AMD’s Interlagos CPUs with Piledriver cores?
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