TSV shrinks memory footprint
Elpida first to sample DDR3 TSV modules
Japanese memory manufacturer Elpida Memory, Inc. (TYO: 6665) has just started sampling some very advanced memory modules.
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Japanese memory manufacturer Elpida Memory, Inc. (TYO: 6665) has just started sampling some very advanced memory modules.
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GlobalFoundries in Dresden has already started the first production of 300mm test wafers with 28nm process technology.
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Every once in a while, people tend to doubt how devious journalists can be, and make fatal mistakes like underestimating them.
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SemiAccurate is happy to offer a new feature called Flashback Friday.
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Adesto Technologies Corp. of Sunnyvale in California is sampling a completely new type of RAM called CBRASM.
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With 36 cores and a power consumption of just 20W the new TILE-Gx 3000 processor from Tilera Corp. could be a potential threat to Intel’s (NASDAQ:INTC) traditional processors.
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The Japanese memory manufacturer Elpida Memory Inc. (TYO:6665) has just announced a new interesting mobile memory module.
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Sources in Taiwan tell SemiAccurate that there are currently Apple marked chips coming off the lines at TSMC.
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This summer the PCI SIG will start an effort to create an external, cabled version of PCI Express that is supposed to compete against Intel’s (NASDAQ:INTC) proprietary Thunderbolt-product that is used by Apple.
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VIA just confirmed that it left BAPCO in a letter reprinted below.
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The Bluetooth SIG has just added 2 new members to its board.
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Anyone watching the industry knows AMD (NYSE:AMD) and ARM (NASDAQ:ARMH) are up to something together, it is more obvious than two teen-agers giggling when they glance at each other.
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At AFDS/Fusion 11, Jem Davies gave a talk about ARM’s view on power and heterogeneous computing
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This week was a surprisingly busy one with AMD’s Fusion Developer Summit taking the center stage in the news.
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